Conductive silver adhesive

2025/09/29 0

Core Product Features

Conductive silver adhesive

Basic Properties

This product is a single-component, low-viscosity conductive silver adhesive. It has passed systematic reliability verification and is suitable for flip-chip bonding of semiconductor chips and precision electronic packaging. Its material system is optimally designed to meet the requirements of high-reliability electronic assembly processes.

Process Characteristics

Through rheological control, the silver adhesive exhibits excellent rheological stability in automated dispensing processes, with a low tailing index and zero stringing phenomenon. This can significantly improve the production efficiency and process yield of SMT (Surface Mount Technology) manufacturing.

Material Performance

High-purity silver powder and a special polymer matrix are used. During the curing process, it shows an extremely low volume shrinkage rate, which effectively suppresses the interface delamination failure mode and ensures the long-term stability of the packaging structure.

Environmental Adaptability

It has completed comprehensive environmental reliability tests in accordance with the MIL-STD-883 military standard. It can maintain stable physical and chemical properties under harsh environmental conditions such as high-low temperature cycling and humidity aging, making it suitable for high-reliability application scenarios such as aerospace and military electronics.

Application Fields

Widely used in electronic manufacturing fields including:

Advanced semiconductor packaging (e.g., Flip Chip, COB, etc.)
MEMS sensor integration
High-density connector assembly
Optical communication device packaging

II. Packaging and Storage Specifications

Category	Technical Requirements
Packaging Specifications	Syringe packaging with different volumes from 1CC to 30CC is provided, as well as customized canning solutions, suitable for laboratory R&D and large-scale mass production needs.
Storage Conditions	1. Storage temperature: -40℃±2℃ 2. Shelf life: 12 months (unopened) 3. Operating specifications: Avoid repeated freeze-thaw cycles 4. Service life after thawing: Complete dispensing within 18 hours

III. Detailed Technical Parameters

1. Basic Physical Property Parameters

Performance Indicator	Test Value	Test Standard
Appearance	Silver-gray paste	Visual observation
Conductive Filler	Nano-scale silver powder	EDS elemental analysis
System Composition	Single-component thermosetting system	–
Density after Curing	3.5±0.1 g/cm³	ASTM D792
Hardness (Shore D)	75±2	ASTM D2240
Viscosity (23℃)	30000±10% cps	Brookfield DV-III
Thixotropic Index (TI)	5.6±0.2	ISO 2884-1

2. Mechanical Performance Parameters

Chip shear strength (25℃, 2×2mm silicon wafer): ≥20 kgf/die (tested in accordance with JESD22-B117A standard)

3. Thermal Performance Parameters

Thermal weight loss (TGA, 300℃): ≤1% (heating rate: 10℃/min, N₂ atmosphere)
Thermal conductivity: 2.5±0.2 W/m・K (tested in accordance with ASTM D5470)
Coefficient of Thermal Expansion (CTE): 40±2 ppm/℃ (temperature range: 25-150℃)
Operating temperature range:
- Conventional working conditions: -55℃~200℃
- Short-term overload conditions: -55℃~300℃

4. Electrical Performance Parameters

Volume resistivity: ≤1×10⁻⁵ Ω・cm (tested 24 hours after curing)

5. Curing Process Parameters

Recommended curing conditions: 175℃±5℃, constant temperature for 1 hour (heating rate: 5℃/min)