Fishing Lights

I. Technical Principles and Core Requirements

1. Heat Dissipation Challenges of Fishing Lights

• High-Power LED Heat Generation: Single light power can exceed 400W, necessitating rapid heat conduction to metal casings or heat sinks.
• Harsh Environment Protection: Must meet IP66/IP68 waterproof ratings and withstand salt fog corrosion (e.g., during coastal fishing vessel operations).
• Lightweight Design: The weight of the entire light should be controlled within 2.1kg (e.g., for a 400W LED fishing light) to avoid overloading fishing vessels.

2. Heat Dissipation Characteristics of Laser Products

• Protection of Precision Optical Components: The junction temperature of laser diodes (LDs) needs to be controlled below 85°C to prevent wavelength drift.
• High Thermal Conductivity and Insulation Requirements: Laser modules typically operate in high-voltage environments (e.g., above 1000V), requiring thermal conductivity gaskets with high insulation (breakdown voltage > 5kV).
• Low Thermal Resistance Interface: The contact thermal resistance between the chip and the cold plate should be < 0.1K·cm²/W to ensure heat dissipation efficiency.

II. Material Selection and Performance Comparison

1. Advantages of Boron Nitride Gaskets

• High Insulation and Voltage Resistance: Breakdown voltage > 10kV, suitable for the high-voltage environments of laser equipment.
• Low Dielectric Loss: Signal attenuation < 0.1dB/cm in the millimeter-wave frequency band (e.g., 28GHz), ideal for 5G communication and LiDAR.

2. Breakthroughs of Graphene Gaskets

• Optimized Vertical Thermal Conductivity: Through directional alignment technology, the vertical thermal conductivity is increased to 130W/m·K (e.g., Xingu GPE-01), 10 times higher than traditional thermal grease.
• Reusability: Supports more than 10 disassembly cycles, reducing electronic waste.

III. Typical Application Cases

1. Innovative Design of Fishing Lights

• Integration of Superconducting Materials: A 400W LED fishing light developed be uses a composite structure of boron nitride thermal conductive film and aluminum alloy heat sink, reducing thermal resistance to 0.3K/W.
• Waterproof Sealing Technology: The lamp head adopts a silicone rubber sealing ring + nano – coating, achieving IP66 protection. It passes the salt fog test (5% NaCl solution, 48 hours) without corrosion.

2. Precision Heat Dissipation of Laser Products

• Fiber Lasers: A 10kW fiber laser uses 0.2mm – thick graphene gaskets, reducing the chip junction temperature from 95°C to 78°C and increasing output power stability by 15%.
• LiDAR: A vehicle – mounted LiDAR uses boron nitride gaskets. Under a temperature cycle of – 40°C to 85°C, the offset of optical components is < 5μm.

IV. Industry Trends and Technological Innovations

1. Material Innovation Directions

• Metamaterial Applications: For example, diamond/copper composite materials with a thermal conductivity > 800W/m·K have been demonstrated in laboratory environments.
• Self – Healing Technology: Gaskets with microcapsule phase – change materials can self – repair worn interfaces after 50 thermal cycles.

2. Manufacturing Process Upgrades

• Nano – Imprint Technology: Achieves a graphene film thickness tolerance of < ±1μm, suitable for high – precision laser modules.
• 3D Printing Customization: For complex heat dissipation paths, honeycomb – shaped thermal conductivity gaskets can be printed, increasing heat diffusion efficiency by 40%.

3. Improvement of Testing Standards

• Extreme Environment Simulation: Uses the laser flash method (LFA) to test thermal conductivity in a wide temperature range from – 196°C to 1500°C.
• Long – term Reliability Verification: Evaluates material aging rates through a 1000 – hour damp heat test (85°C/85%RH).

V. Selection Recommendations

VI. Challenges and Countermeasures

1. Material Cost Control: Reduce unit prices through large – scale production (e.g., boron nitride annual production capacity > 1000 tons).
2. Adaptability to Extreme Environments: Develop silicone rubber gaskets resistant to – 200°C low temperatures, which have been verified in liquid hydrogen cooling systems.
3. Improvement of Processing Precision: Use laser cutting technology to achieve a gasket thickness tolerance of < ±5μm.