A “Dual-Performance Solution for Light Transmittance and Conductivity

Core Technology: Three Performance Breakthroughs Redefining Industry Standards

• Ultimate Balance of Dual Properties: Boasting a UV transmittance of up to 90%, it perfectly meets the light source transmission requirements of the NIL lithography process. Meanwhile, it forms a high-density AgNWs conductive network with a charge relaxation time down to the millisecond level, rapidly neutralizing static charge accumulation generated during imprinting and avoiding micro-structure damage at the source.
• Exceptional Structural Stability: Benefiting from the excellent flexibility of the PDMS elastic substrate, the film shows only a 12% increase in resistance after 40% tensile deformation. It maintains stable conductivity in repeated imprinting cycles, adapting to flexible substrates and complex curved surface imprinting scenarios.
• Leapfrog Improvement in Yield: Targeting core pain points in the NIL process caused by static electricity, such as pattern offset and adhesion, it significantly boosts the imprinting yield from 65% in traditional processes to 92%, drastically cutting production costs and rework losses.

Differentiating Advantages: Filling Gaps in High-End Manufacturing and Unlocking Diverse Application Scenarios

• Breakthrough in Technical Gaps: Focusing on the niche field of ESD protection for high-precision micro-nano manufacturing, it overcomes technical challenges of conventional conductive films including insufficient light transmittance and poor conductivity of elastic substrates. It is the industry’s first composite film product integrating high light transmittance, fast electrostatic dissipation, and high flexibility.
• Precise Scenario Adaptation: Deeply matched with manufacturing processes demanding stringent UV-band light transmittance, precision ESD protection, and material flexibility, including quantum dot display panel fabrication, DNA microarray chip preparation, and micro-nano sensor lithography. It resolves prevailing material drawbacks: “transparent but non-conductive, conductive but opaque, and brittle due to poor flexibility”.

Core Value: Empowering High-End Manufacturing, Reducing Costs, Boosting Efficiency and Improving Quality

• Technical Empowerment: Through the innovative AgNWs/PDMS composite structure, it achieves simultaneous breakthroughs in three core properties, helping customers overcome process technical bottlenecks.
• Cost Reduction & Efficiency Enhancement: Raising the imprinting yield from 65% to 92% greatly reduces material waste and rework costs while shortening production cycles.
• Quality Assurance: Stable electrical conductivity and light transmittance ensure the replication accuracy of micro-nano structures, enhancing the reliability and consistency of end products.