I. Core Application Logic: The Key Path to Breaking the “Thermal Bottleneck”

Comprehensive Analysis of the Core Application Scenarios of Thermal Conductive Sealant

• Near-junction Heat Conduction: Directly contacts the heat-generating core of the chip to reduce junction temperature (e.g., diamond substrate lowers junction temperature by 30-50℃).
• Interface Thermal Resistance Bridging: Fills the microscopic gaps between devices and heat sinks (actual contact area is only 10%), replacing air (thermal conductivity: 0.025W/m·K).
• Multi-dimensional Heat Diffusion: Adapts to thermal management needs in special scenarios such as flexible and micro-nano applications.

II. Mainstream Material Types and Scenario Implementation

(1) Chip Core Layer: “Close-proximity Protection” with Ultra-high Thermal Conductivity Materials

Diamond-based Materials

• Performance Advantages: Thermal conductivity reaches 2000-2200W/m·K (more than 5 times that of copper), making it an ideal substrate for third-generation semiconductors.
• Technological Breakthroughs: The Ningbo Institute of Materials Technology & Engineering, Chinese Academy of Sciences, has prepared 4-inch ultra-thin diamond films with a warpage ≤10μm, enabling “self-adhesive” bonding of chips.
• Application Directions: AI chips, radio frequency (RF) devices; future development targets large-size demands of 6 inches and above.

Liquid Metals

• Performance Advantages: Thermal conductivity >30W/m·K, with interface thermal resistance 80% lower than that of thermal grease.
• Typical Applications: Gallium-based TIM is adopted in Intel Core i9 and AMD Ryzen 7000 series processors, reducing core temperature by 5-10℃; it serves as a core component in the cooling system of Sony PS5.

(2) Packaging and Substrate Layer: “Connecting Link” with Insulating and Thermal Conductive Properties

Ceramic-based Materials

• Silicon Nitride (Si₃N₄): Thermal conductivity of 90W/m·K; its AMB substrate is applied in the SiC power module of Tesla Model 3, improving driving range by 12%.
• Aluminum Nitride (AlN): Thermal conductivity of 100-200W/m·K, suitable for high-frequency insulation requirements of 5G base station RF modules.

Low-dielectric & High-thermal Conductivity Polymers

• The liquid crystal polymer ST38PB, developed by the Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences, has an in-plane thermal conductivity of 0.62W/m·K (3.4 times that of the original material) and a dielectric constant of only 2.4 at 10GHz.
• Application Scenarios: High-frequency PCB, chip insulating and heat-dissipating layers, resolving the contradiction between signal crosstalk and heat dissipation.

(3) Interface Connection Layer: “Gap Filling” with TIM Materials

Thermal Conductive Silicone Gel

• Features: Thermal conductivity up to 12W/m·K; maintains flexibility after curing, suitable for vibration environments.
• Applications: 400G/800G optical modules, vehicle-mounted IGBT modules, battery management systems (BMS).

Phase Change Materials (PCM)

• Principle: Melts and absorbs heat at 50-100℃, suppressing short-term pulse thermal shock.
• Implementation: Power amplifiers of 5G base stations, lidars, preventing performance degradation caused by sudden temperature rise.

(4) Micro-nano and Flexible Scenarios: “Precise Adaptation” with New Materials

Two-dimensional Transition Metal Carbides (MoS₂, WS₂)

• Performance: Thermal conductivity of 200-300W/m·K, 5-8 times that of silicon-based materials.
• Innovative Applications:
  • MEMS sensors: MoS₂/TiO₂ heterojunction increases sensitivity by 3 times.
  • Wearable devices: Liquid metal-two-dimensional material composite films maintain a thermal conductivity of 287W/m·K even under 200% stretching.

Diamond Composite Materials

• Polymer-based: After filling with surface-modified diamond, thermal conductivity increases by 5-10 times, applied in TIM of mobile phone chips.
• Metal-based: Diamond/copper composite materials have a thermal conductivity of 600W/m·K, suitable for aerospace electronic equipment.